10-Aug-2022 | Facts and Factors
According to Facts and Factors, the global system in package (SiP) technology market size was worth USD 14,952.5 million in 2021 and is estimated to grow to USD 25,774.9 million by 2028, with a compound annual growth rate (CAGR) of approximately 9.5% over the forecast period. The report analyzes the system in package sip technology market's drivers, restraints/challenges, and their effect on the demands during the projection period. In addition, the report explores emerging opportunities in the system in the package sip technology market.
A system in package (SiP) is a single module made up of several integrated circuits that carry out all of the tasks associated with an electronic system. SiPs often combine all external passive components onto a single tiny chip, which reduces the cost of designing and building a printed circuit board (PCB). The SiP is less corrosive, smaller, more cost-effective, and can function in demanding system conditions. It is widely utilized in many sectors, including telecommunications, automotive, and consumer electronics. An illustration of a SiP could have many chips, such as a specialized CPU, DRAM, and flash memory, together with passive parts, such as capacitors and resistors, installed on the same substrate. This means that a multi-chip package may be used to build a fully functioning unit that only requires a small number of additional components. This lessens the complexity of the printed circuit board and the overall design, which is especially useful in contexts with limited space, such as MP3 players and mobile phones.
Browse the full “System in Package (SiP) Technology Market Size, Share, Growth Analysis Report By Packaging Technology (2D IC Packaging, 2.5D IC Packaging, and 3D IC Packaging), By Packaging Method (Wire Bond and Flip Chip), By End-User (Consumer Electronics, Automotive, Telecommunication, Industrial Systems, Aerospace and Defense, and Others), and By Region - Global and Regional Industry Insights, Overview, Comprehensive Analysis, Trends, Statistical Research, Market Intelligence, Historical Data and Forecast 2022 – 2028" report at https://www.fnfresearch.com/system-in-package-sip-technology-market
Several factors, including the introduction of 5G network-connected devices, the high demand for small electronics devices with internet connectivity, and the increase in Internet of Things (IoT) devices, are predicted to propel the growth of the global system in package (SiP) technology industry. In addition, the industry is developing as smartphones, and smart wearables are more adopted. Higher levels of integration, however, cause thermal problems, which are a significant commercial limitation. On the other hand, strong demand from Asia-Pacific is anticipated to drive market expansion throughout the projection period.
Segmental Overview
The global system in the package sip technology market is segregated based on packaging technology, packaging method, end-users, and regions. Based on packaging technology, the market is divided into 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. According to packaging technology, the 2.5D IC packaging category led the market in 2021. Based on the packaging method, the market is divided into wire bonds and flip chips. According to the packaging method, the wire bonds segment led the market in 2021. Based on end-users, the market is divided into consumer electronics, automotive, telecommunications, industrial systems, aerospace and defense, and others. The automobile segment led the market in 2021, according to end users.
Regional Overview
The global system in the package sip technology market is divided into geographic regions: North America, Latin America, Europe, Asia Pacific, Middle East, and Africa. In terms of market share and revenue, Asia-Pacific now rules the package (SIP) market system and will maintain this dominance during the projection period. This is a result of the expanding consumer electronics industry's use of technology and the increasing number of businesses operating in this area.
The market in the region is further boosted by the presence of various electronic packaging companies that provide electronic packaging technology and materials, such as Samsung Electronics Corporation Ltd and Taiwan Semiconductor Manufacturing Co. Ltd. Additionally, the region's expanding population and increasing disposable income are two significant factors boosting consumer electronics demand, which is fueling the region's electronic packaging industry even more quickly.
Report Scope
Report Attribute |
Details |
Market Size in 2021 |
USD 14,952.5 Million |
Projected Market Size in 2028 |
USD 25,774.9 Million |
CAGR Growth Rate |
9.5% CAGR |
Base Year |
2021 |
Forecast Years |
2022-2028 |
Key Market Players |
Jiangsu Changjiang Electronics Technology Co. Ltd., Chipmos Technologies Inc., Powertech Technologies Inc., Ase Group, Amkor Technology Inc., Fujitsu Ltd, Toshiba Corporation, Renesas Electronics Corporation, Samsung Electronics Co Ltd, Qualcomm Inc., and Others |
Key Segment |
By Packaging Technology, Packaging Method, End User, and Region |
Major Regions Covered |
North America, Europe, Asia Pacific, Latin America, and the Middle East & Africa |
Purchase Options |
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Key Players Insights
Key players in the global system in package sip technology market include Jiangsu Changjiang Electronics Technology Co., Ltd., Chipmos Technologies Inc., Powertech Technologies Inc., Ase Group, Amkor Technology Inc., Fujitsu Ltd, Toshiba Corporation, Renesas Electronics Corporation, Samsung Electronics Co Ltd, and Qualcomm Inc.
Recent Development:
- In September 2020, Apple unveiled the Apple Watch Series 6, which includes the ground-breaking Blood Oxygen function, giving consumers even more insight into their general wellbeing. The S6 System in Package (SiP), a speedier processor, and a new generation of always-on altimeter are just a few of the noteworthy hardware upgrades that the Apple Watch Series 6 offers. It also boasts the most vibrant collection of case finishes and band colors.
The Global System In Package (SiP) Technology Market is segmented as follows:
By Packaging Technology
- 2D IC Packaging
- 2.5D IC Packaging
- 3D IC Packaging
By Packaging Method
By End User
- Consumer Electronics
- Automotive
- Telecommunication
- Industrial System
- Aerospace and Defense
- Others
By Region
-
North America
- Europe
- France
- The UK
- Spain
- Germany
- Italy
- Nordic Countries
- Benelux Union
- Belgium
- The Netherlands
- Luxembourg
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- Australia
- South Korea
- Southeast Asia
- Indonesia
- Thailand
- Malaysia
- Singapore
- Rest of Southeast Asia
- Rest of Asia Pacific
- The Middle East & Africa
- Saudi Arabia
- UAE
- Egypt
- South Africa
- Rest of the Middle East & Africa
- Latin America
- Brazil
- Argentina
- Rest of Latin America
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